Power PCB Board Design of The Whole Process

The details of PCB Process

Power came in, and a first filter capacitor, capacitor from filtering out, giving back device. Because PCB is above the line but not the ideal conductor, the existence of resistance and inductance is not the same. The multilayer pcb design is also the same as this. If the filter capacitor in front of alternating current, ripple will be larger, the filtering effect is not good. A condition of wide line will do fine, not a sharp corner chamfer, nor with rectangular. The ground should be wide, preferably using a large area of copper, and the docking sites have improved considerably. The capacitor is switching device (gate) or other filter / decoupling components and of the setting, the capacitor arrangement should be as close as possible to these components, was too far away to no effect.

Multilayer PCB board

The AC power line, the fuse prior to the two line of the minimum safety distance is not less than 6MM, and two lines and the casing or machine grounding safety distance is not less than 8MM.When the fuse wiring requirements: zero, the minimum creepage distance is not less than 3MM.Zone of high pressure and low pressure area minimum creepage distance is not less than 8MM, less than 8MM or equal to 8MM. To open 2MM safety groove and multilayer pcb board. High pressure area must have high voltage warning logo screen printing, namely the exclamation point, triangle symbol; high pressure area must use the silk screen frame, frame silkscreen shall be not less than 3MM.High voltage rectifier filter between positive and negative minimum safety distance of not less than 2MM

Component layout and wiring

Component layout and wiring on the product life, stability, EMC have great influence, and it should pay special attention to the local. In general, there should be some of the following principles: first place and structure of the fixed position of the components, such as power outlets, lights, switches, connectors and the like, these devices are placed after the software used on the LOCK function of the lock, so that will not be mistaken for mobile. Put line special elements and components, such as a heating element, transformer, and IC etc. The last placed small device. Pay attention to heat, but also special attention problem of heat dissipation component layout. For high power circuit, should be those heating elements such as power tube, transformer to pull over scattered placed, easy heat dissipation, not concentrated in one place, and it is also not a high capacitance too close to the electrolyte of premature aging. After the completion of wiring, have to do is to text, individual components, walk the line to do some adjustments and copper. This work should not be too early, otherwise it will affect the speed, and to give the wiring trouble.

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