LED the lamp thermal conductivity material across the thermal silica film

Silicone thermal conductive sheet of thermal silica film thermal conductivity graphite sheet Thermal Conductive Pad thermally conductive double-sided adhesive with high thermal conductivity material across the electronic thermal conductivity of heat difficult problem to solve. Manufacturing according to customer requirements. The power thermal silica film manufacturers manufacturers larger space electronic equipment thermal design have been proven design here do not do elaborate. The rapid development of microelectronics technology, the chip size is getting smaller and smaller, while the operation speed is getting faster and faster, this means a greater amount of heat, such as 3.6G Pentium 4 Extreme Edition Intel processor running generate heat up to 115W, , higher demands on the chip cooling. Designers must adopt advanced cooling technology and excellent heat dissipation material to effectively remove heat, to ensure that the chip can withstand the highest temperature within normal working. Electronic equipment and terminal appearance of more and more to thin small development, TV development from CRT to LCD flat-panel TVs, desktop computer to a laptop, digital set-top boxes, portable CD, thermal design with traditional forms, due to class The product is relatively thin and small. Statistics data indicate electronic components temperature rise of 2 degrees, reliability, decreased by 10; temperature rise of 50 degrees when the life of 25-degree temperature rise 1/6. Temperature is the most important factor affecting equipment reliability. This requires technically take measures to restrict the chassis and components, temperature rise, which is a thermal design.

Thermal design principles, reduce heat, that the selection of better control methods and techniques, such as phase shift control technology, synchronous rectification technology and other technologies, the other is the selection of low-power devices, reducing the number of heating devices, to increase crude printed lines width, improve power efficiency. Enhance heat dissipation by conduction, radiation, convection technology to heat transfer, but the appearance of flat products, first of all, from the space can not be used more heat aluminum and fan, and not allowed to strengthen-cooled whole thermal design, can not use the convection form. The same radiation heat way flat space is difficult to do. Everyone wants to think the use of the chassis for heat, the thermal conductivity of soft silicone do not consider the benefits plus fan power, fan and fan and will not cause more dust, no fan sky noise can really take advantage of the machine casing heat? The power thermal silica film application opportunities.

Power thermal silica film is a heat transfer interface materials, sheet material, size and shape of the heating power devices arbitrary cut power thermal silica film has a good ability to conduct heat and insulating properties, and its role is filled heating power devices and cooling The gap between the power supply thermal silica film is an alternative to the best product of Dow Corning thermal grease thermal paste plus mica sheet (insulation material) dual cooling system. The coefficient of thermal conductivity of the product on silica gel fins 6.0W/mK, while the air thermal conductivity is 0.03w/mk; resistance to voltage breakdown value of 4000 volts or more, the insulation requirements can be used in most electronic devices. Process thickness from 0.5mm to 5mm range, plus 0.5mm one that 0.5mm1mm1.5mm2mm until 5mm, special requirements may be increased to 10mm, different thickness is to allow designers to easily fever the size of the gap between the body and cooling facilities to choose different thickness product reach The best filling effect. Power thermal silica film heat is so simple: one can! Key Features: thermal conductivity, insulation, self-adhesive, shock, filled. Now, across the electronic variety series of thermally conductive silicone products to market, and is widely used in the power supply, high power LED, radiator, flat-panel TVs, laptops, home appliances, automotive and electronics industries.

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